We offer a variety of liquid molding compound for comporession molding. Suitable material can be selected for different types of semiconductor package.
Semiconductor (ICs, Sensors, MEMS, Power Devices, etc.)
Liquid Molding Compound
- Liquid at room temperature and dust-free suitable for clean room environment
- The ability to cure at lower temperatures in the range of 110-125 °C
- Extremely low warpage and low thermal strain on devices