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We offer a variety of liquid molding compound for comporession molding. Suitable material can be selected for different types of semiconductor package.


Semiconductor (ICs, Sensors, MEMS, Power Devices, etc.)

Additional Information

Liquid Molding Compound

  • Liquid at room temperature and dust-free suitable for clean room environment
  • The ability to cure at lower temperatures in the range of 110-125 °C
  • Extremely low warpage and low thermal strain on devices


Yenn Leng Tan

Sales Manager