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Epoxy potting material is a specialized resin used to encapsulate and protect electronic components, circuits, and devices from environmental factors such as moisture, dust, chemicals, and mechanical stress.

Applications

  • Electric Vehicles (EVs):
    Power inverters, motor controllers, and battery management systems.
  • Renewable Energy:
    Solar inverters, wind turbine converters, and energy storage systems.
  • Industrial Electronics:
    Motor drives, power supplies, and automation systems.
  • Consumer Electronics:
    High-power chargers, adapters, and LED drivers.

Features

  • Thermal Stability:
    Withstands extreme temperatures, maintaining structural integrity and performance in demanding environments.
  • Low CTE (Coefficient of Thermal Expansion):
    Minimizes stress on components during thermal cycling, enhancing long-term durability.
  • Chemical Resistance:
    Resists moisture, solvents, and corrosive substances, ensuring protection in harsh operating conditions.
  • High adhesion:
    Complex substrate interfaces with interconnects.
  • Customizable Formulations:
    Tailored solutions to meet specific application requirements, including viscosity, cure time, and mechanical properties.
  • Flammability level:
    UL V-0 possible for 3.2mm and 1.6mm

Additional Information

Why Choose Nagase’s Epoxy Potting Materials?

  • Proven Expertise:
    Decades of experience in developing advanced materials for electronics and power modules.
  • Custom Solutions:
    Ability to tailor formulations to meet specific thermal, mechanical, and electrical requirements.
  • Global Support:
    Technical expertise and customer service available worldwide to ensure seamless integration and optimal performance.
  • Sustainability:
    Environmentally friendly formulations designed to meet industry regulations and reduce environmental impact.

Advantage

Technical Highlights:

  • Thermal Conductivity:
    Up to 2.5 W/m·K (customizable for higher requirements).
  • Operating Temperature Range:
    Outstanding heat resistance with Tg > 210°C.
  • Cure Time:
    2 step fast-cure formulations available for high-volume production.
  • Certifications:
    Compliant with RoHS, REACH, and UL standards.

Electronics

Yenn Leng Tan

Sales Manager