High-Resolution Dry Film Photoresist (Negative Tone)

Precision patterning material for advanced lithographic applications.
Enables high-resolution imaging in semiconductor and MEMS fabrication using negative-tone photoresist films.

Reliable Negative-Tone Imaging for MEMS and Semiconductor Lithography

High-resolution dry film photoresists (negative tone) are light-sensitive materials designed for the formation of durable, high-definition patterns on substrates used in microfabrication. By crosslinking upon UV exposure, these photoresists create negative-tone patterns that remain on the substrate after development, making them ideal for precise and stable microstructures.

NAGASE offers four series of negative-tone dry film photoresists optimized for laminating applications. They are widely used in semiconductor manufacturing and MEMS fabrication, where excellent resolution, adhesion, and process compatibility are essential.

NAGASE supplies high-resolution dry film photoresists with negative tone globally for advanced semiconductor and MEMS applications – backed by technical expertise and comprehensive logistics support.

Applications

Negative-tone dry film photoresists are used to create high-resolution, durable patterns for microfabrication processes.

  • Semiconductor lithography – Patterning of ICs, wafers, and interconnect layers
  • MEMS device fabrication – Structuring of sensors, actuators, and microcomponents
  • Advanced packaging – Redistribution layers and package-level patterning
  • Electroplating masks – High-precision masking for copper or gold deposition
  • Etching and micromachining – High-resolution resist patterns for selective material removal

Features

These negative-tone dry film photoresists offer excellent resolution, adhesion, and process stability for demanding imaging applications.

  • High-resolution patterning – Enables sub-micron feature definition for microfabrication
  • Excellent adhesion – Strong bonding to various substrate types including metals and silicon
  • Thermal and chemical resistance – Suitable for harsh process conditions
  • Dry lamination capability – Easy and consistent application via laminator equipment
  • Multiple product series – Tailored properties to suit different exposure and development requirements

Additional Information

  • Long pot life even at room temperature
  • Flux compatibility
  • Low curing temperature, Short curing time
  • Additional modification e.g.: snap cure, thermal conductivity, reworkability
  • Meets the requirements of RoHS and EU REACH

Frequently Asked Questions about High-Resolution Dry Film Photoresist (Negative Tone)

What is a negative-tone dry film photoresist?
It is a light-sensitive material that crosslinks when exposed to UV light, leaving the exposed areas intact after development to form a negative pattern.

Where are negative-tone photoresists used?
They are primarily used in semiconductor lithography, MEMS fabrication, electroplating, and other microstructuring applications.

How is dry film photoresist applied?
It is laminated onto the substrate using heat and pressure, then exposed to UV light through a photomask before development.

What are the advantages of using dry film over liquid photoresist?
Dry film offers uniform thickness, clean edges, and simplified processing with minimal waste and contamination.

Does NAGASE offer different versions for specific use cases?
Yes, NAGASE offers four product series optimized for various substrate materials, process conditions, and resolution requirements.

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Electronics

Yenn Leng Tan
Sales Manager